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\begin{document}
\title{\Large \bf{Yield-Aware Time-Efficient Testing and Self-fixing Design For TSV-Based 3D ICs }}
 \author{Jing Xie, Yu Wang$^{*}$, Yuan Xie\\
 \normalsize Pennsylvania State University, \\ University Park, PA, USA\\%[-3pt]
 \normalsize $^{*}$Tsinghua University, Beijing, China\\%[-3pt]
%\normalsize University Park, PA, 16802, USA \\[-3pt]
% \normalsize Phone: 1-814-863-7325\\[-3pt]
 \normalsize \{jingxie, yuanxie\}@cse.psu.edu}
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%TSV, 3D testing, yield, redundancy, Known-Good-Die, Known-Good-Stack.
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